
SMOOTH FLOW LOW TEMP SOLDER PAST
Name | Value |
---|---|
Mfr | Chip Quik Inc. |
Form | Jar, 8.8 oz (250g) |
Type | Solder Paste |
Series | Smooth Flow™ |
Package | Bulk |
Process | Lead Free |
Diameter | - |
Flux Type | No-Clean |
Mesh Type | 5 |
Shelf Life | 6 Months |
Wire Gauge | - |
Composition | Bi57.6Sn42Ag0.4 (57.6/42/0.4) |
Melting Point | 280°F (138°C) |
Product Status | Active |
Shelf Life Start | Date of Manufacture |
Base Product Number | NC191 |
Storage/Refrigeration Temperature | 37°F~46°F(3°C~8°C) |