
SMOOTH FLOW LEAD-FREE SOLDER PAS
Name | Value |
---|---|
Mfr | Chip Quik Inc. |
Form | Syringe, 0.53 oz (15g), 5cc |
Type | Solder Paste |
Series | Smooth Flow™ |
Package | Bulk |
Process | Lead Free |
Diameter | - |
Flux Type | No-Clean |
Mesh Type | 4 |
Shelf Life | 6 Months |
Wire Gauge | - |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Melting Point | 422 ~ 428°F (217 ~ 220°C) |
Product Status | Active |
Shelf Life Start | Date of Manufacture |
Base Product Number | NC191 |
Storage/Refrigeration Temperature | 37°F~46°F(3°C~8°C) |