
SMOOTH FLOW LOW TEMP SOLDER PAST
Name | Value |
---|---|
Mfr | Chip Quik Inc. |
Form | Syringe, 0.35 oz (10g), 3cc |
Type | Solder Paste |
Series | Smooth Flow™ |
Package | Bulk |
Process | - |
Diameter | - |
Flux Type | No-Clean |
Mesh Type | 4 |
Shelf Life | 12 Months |
Wire Gauge | - |
Composition | Bi57Sn42Ag1 (57/42/1) |
Melting Point | 279°F (137°C) |
Product Status | Active |
Shelf Life Start | Date of Manufacture |
Base Product Number | NC191 |
Storage/Refrigeration Temperature | 37°F~46°F(3°C~8°C) |