SMOOTH FLOW LOW TEMP SOLDER PAST
| Name | Value |
|---|---|
| Mfr | Chip Quik Inc. |
| Form | Syringe, 0.35 oz (10g), 3cc |
| Type | Solder Paste |
| Series | Smooth Flow™ |
| Package | Bulk |
| Process | - |
| Diameter | - |
| Flux Type | No-Clean |
| Mesh Type | 4 |
| Shelf Life | 12 Months |
| Wire Gauge | - |
| Composition | Bi57Sn42Ag1 (57/42/1) |
| Melting Point | 279°F (137°C) |
| Product Status | Active |
| Shelf Life Start | Date of Manufacture |
| Base Product Number | NC191 |
| Storage/Refrigeration Temperature | 37°F~46°F(3°C~8°C) |
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