
SOLDER PASTE IN JAR 40G (T7) SAC
Name | Value |
---|---|
Mfr | Chip Quik Inc. |
Form | Jar, 1.41 oz (40g) |
Type | Solder Paste |
Series | - |
Package | Bulk |
Process | - |
Diameter | - |
Flux Type | No-Clean |
Mesh Type | 7 |
Shelf Life | 6 Months |
Wire Gauge | - |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Melting Point | 423 ~ 428°F (217 ~ 220°C) |
Product Status | Active |
Shelf Life Start | Date of Manufacture |
Base Product Number | SMD291 |
Storage/Refrigeration Temperature | 37°F~46°F(3°C~8°C) |