
THERMALLY STABLE SOLDER PASTE WS
Name | Value |
---|---|
Mfr | Chip Quik Inc. |
Form | Syringe, 1.23 oz (34.869g) |
Type | Solder Paste |
Series | CHIPQUIK® |
Weight | - |
Package | Bulk |
Process | - |
Diameter | - |
Flux Type | Water Soluble |
Mesh Type | 4 |
Shelf Life | 12 Months |
Wire Gauge | - |
Composition | Bi57.6Sn42Ag0.4 (57.6/42/0.4) |
Melting Point | 280°F (138°C) |
Shipping Info | - |
Product Status | Active |
Shelf Life Start | Date of Manufacture |
Storage/Refrigeration Temperature | 37°F~77°F(3°C~25°C) |