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HMP 366 3% .022DIA. 23AWG

$24.57
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HMP 366 3% .022DIA. 23AWG
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HMP 366 3% .022DIA. 23AWG

NameValue
MfrHarimatec Inc.
FormSpool, 8.8 oz (250g)
TypeWire Solder
Series366
Weight0.551 lb (249.93 g)
PackageBulk
ProcessLeaded
Diameter0.022" (0.56mm)
Flux TypeRosin Activated (RA)
Shelf Life-
Wire Gauge23 AWG, 24 SWG
CompositionPb93.5Sn5Ag1.5 (93.5/5/1.5)
Melting Point565 ~ 574°F (296 ~ 301°C)
Shipping Info-
Product StatusActive
Digi-Key Storage-
Shelf Life Start-
Storage/Refrigeration Temperature-