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HMP 366 3% .028DIA 21AWG

$43.82
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HMP 366 3% .028DIA 21AWG
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HMP 366 3% .028DIA 21AWG

NameValue
MfrHarimatec Inc.
FormSpool, 17.64 oz (500g)
TypeWire Solder
Series366
Weight1.1 lbs (499 g)
PackageBulk
ProcessLeaded
Diameter0.028" (0.71mm)
Flux TypeRosin Activated (RA)
Shelf Life-
Wire Gauge21 AWG, 22 SWG
CompositionPb93.5Sn5Ag1.5 (93.5/5/1.5)
Melting Point565 ~ 574°F (296 ~ 301°C)
Shipping Info-
Product StatusActive
Digi-Key Storage-
Shelf Life Start-
Storage/Refrigeration Temperature-