RFI EMI GROUNDING MATERIAL 25FT
| Name | Value |
|---|---|
| Mfr | Laird Technologies EMI |
| Type | Fingerstock |
| Shape | - |
| Width | 0.280" (7.11mm) |
| Height | 0.110" (2.79mm) |
| Length | 16.000" (406.40mm) |
| Series | All-Purpose |
| Package | Bulk |
| Plating | Tin |
| Material | Beryllium Copper |
| Shelf Life | - |
| Product Status | Active |
| Shelf Life Start | - |
| Attachment Method | Adhesive |
| Plating - Thickness | 299.21µin (7.60µm) |
| Operating Temperature | 121°C |
| Storage/Refrigeration Temperature | - |
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