
SOLDER PASTE SN63/PB37 500G T5
Name | Value |
---|---|
Mfr | Chip Quik Inc. |
Form | Jar, 17.64 oz (500g) |
Type | Solder Paste |
Series | - |
Package | Jar |
Process | Leaded |
Diameter | - |
Flux Type | No-Clean |
Mesh Type | 5 |
Shelf Life | 12 Months |
Wire Gauge | - |
Composition | Sn63Pb37 (63/37) |
Melting Point | 361°F (183°C) |
Shipping Info | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. |
Product Status | Active |
Shelf Life Start | Date of Manufacture |
Base Product Number | SMD291 |
Storage/Refrigeration Temperature | 37°F~46°F(3°C~8°C) |