
SOLDER PASTE SAC305 500G
Name | Value |
---|---|
Mfr | Chip Quik Inc. |
Form | Jar, 17.64 oz (500g) |
Type | Solder Paste |
Series | - |
Package | Jar |
Process | Lead Free |
Diameter | - |
Flux Type | No-Clean |
Mesh Type | 3 |
Shelf Life | 6 Months |
Wire Gauge | - |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Melting Point | 423 ~ 428°F (217 ~ 220°C) |
Shipping Info | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. |
Product Status | Active |
Shelf Life Start | Date of Manufacture |
Base Product Number | SMD291 |
Storage/Refrigeration Temperature | 37°F~46°F(3°C~8°C) |