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SOLDERPASTE NO CLEAN 63/37 500GM

$111.67
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SOLDERPASTE NO CLEAN 63/37 500GM
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SOLDERPASTE NO CLEAN 63/37 500GM

NameValue
MfrKester Solder
FormJar, 17.64 oz (500g)
TypeSolder Paste
SeriesProfile®, 256
Weight1.1 lbs (499 g)
PackageJar
ProcessLeaded
Diameter-
Flux TypeNo-Clean
Mesh Type3
Shelf Life6 Months
Wire Gauge-
CompositionSn63Pb37 (63/37)
Melting Point361°F (183°C)
Shipping InfoShips with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Product StatusActive
Shelf Life StartDate of Manufacture
Base Product Number70-0102
Storage/Refrigeration Temperature32°F~50°F(0°C~10°C)