SOLDERPASTE NO CLEAN 63/37 500GM
| Name | Value |
|---|---|
| Mfr | Kester Solder |
| Form | Jar, 17.64 oz (500g) |
| Type | Solder Paste |
| Series | Profile®, 256 |
| Weight | 1.1 lbs (499 g) |
| Package | Jar |
| Process | Leaded |
| Diameter | - |
| Flux Type | No-Clean |
| Mesh Type | 3 |
| Shelf Life | 6 Months |
| Wire Gauge | - |
| Composition | Sn63Pb37 (63/37) |
| Melting Point | 361°F (183°C) |
| Shipping Info | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. |
| Product Status | Active |
| Shelf Life Start | Date of Manufacture |
| Base Product Number | 70-0102 |
| Storage/Refrigeration Temperature | 32°F~50°F(0°C~10°C) |
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