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SOLDER PASTE LOW TEMP T4 250G

$83.95
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SOLDER PASTE LOW TEMP T4 250G
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SOLDER PASTE LOW TEMP T4 250G

NameValue
MfrChip Quik Inc.
FormJar, 8.8 oz (250g)
TypeSolder Paste
Series-
PackageJar
ProcessLead Free
Diameter-
Flux TypeNo-Clean
Mesh Type4
Shelf Life6 Months
Wire Gauge-
CompositionBi57.6Sn42Ag0.4 (57.6/42/0.4)
Melting Point281°F (138°C)
Shipping InfoShips with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Product StatusActive
Digi-Key StorageRefrigerated
Shelf Life StartDate of Manufacture
Base Product NumberSMDLTL
Storage/Refrigeration Temperature37°F~46°F(3°C~8°C)