
JET PRINTING SOLDER PASTE SN63/P
Name | Value |
---|---|
Form | Syringe, 3.53 oz (100g) |
Type | Solder Paste |
Series | CHIPQUIK® |
Weight | - |
Process | Leaded |
Diameter | - |
Flux Type | No-Clean |
Packaging | Bulk |
Shelf Life | 12 Months |
Wire Gauge | - |
Composition | Sn63Pb37 (63/37) |
Part Status | Active |
Manufacturer | Chip Quik Inc. |
Melting Point | 361°F (183°C) |
Shipping Info | - |
Shelf Life Start | Date of Manufacture |
Storage/Refrigeration Temperature | - |