
LEADED NO CLEAN SOLDER PASTE
Name | Value |
---|---|
Mfr | MG Chemicals |
Form | Jar, 8.8 oz (250g) |
Type | Solder Paste |
Series | 4900 |
Package | Bulk |
Process | Lead Free |
Diameter | - |
Flux Type | No-Clean |
Mesh Type | - |
Shelf Life | 24 Months |
Wire Gauge | - |
Composition | Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4) |
Melting Point | 423 ~ 430°F (217 ~ 221°C) |
Product Status | Active |
Shelf Life Start | Date of Manufacture |
Base Product Number | 4900 |
Storage/Refrigeration Temperature | 35°F~50°F(2°C~10°C) |