THERMALLY STABLE SOLDER PASTE NO
| Name | Value |
|---|---|
| Mfr | Chip Quik Inc. |
| Form | Jar, 8.8 oz (250g) |
| Type | Solder Paste |
| Series | - |
| Package | Bulk |
| Process | Leaded |
| Diameter | - |
| Flux Type | No-Clean |
| Mesh Type | 4 |
| Shelf Life | 12 Months |
| Wire Gauge | - |
| Composition | Sn63Pb37 (63/37) |
| Melting Point | 361°F (183°C) |
| Shipping Info | - |
| Product Status | Active |
| Shelf Life Start | Date of Manufacture |
| Base Product Number | TS391A |
| Storage/Refrigeration Temperature | 68°F~77°F(20°C~25°C) |
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