SP,CON,AU,TNR 10X2.5X4.8MM
| Name | Value |
|---|---|
| Mfr | Laird Technologies EMI |
| Type | Fingerstock |
| Shape | - |
| Width | 0.098" (2.50mm) |
| Height | 0.394" (10.00mm) |
| Length | 0.189" (4.80mm) |
| Series | B3G |
| Package | Bulk |
| Plating | Gold |
| Material | Beryllium Copper |
| Shelf Life | 12 Months |
| Product Status | Active |
| Shelf Life Start | - |
| Attachment Method | Solder |
| Plating - Thickness | - |
| Operating Temperature | - |
| Storage/Refrigeration Temperature | 50°F~77°F(10°C~25°C) |
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