
SP,CON,AU,TNR 10X2.5X4.8MM
Name | Value |
---|---|
Mfr | Laird Technologies EMI |
Type | Fingerstock |
Shape | - |
Width | 0.098" (2.50mm) |
Height | 0.394" (10.00mm) |
Length | 0.189" (4.80mm) |
Series | B3G |
Package | Bulk |
Plating | Gold |
Material | Beryllium Copper |
Shelf Life | 12 Months |
Product Status | Active |
Shelf Life Start | - |
Attachment Method | Solder |
Plating - Thickness | - |
Operating Temperature | - |
Storage/Refrigeration Temperature | 50°F~77°F(10°C~25°C) |