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INDUSTRIAL-PRE-GEN EK 8-UDFN SPI

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INDUSTRIAL-PRE-GEN EK 8-UDFN SPI
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INDUSTRIAL-PRE-GEN EK 8-UDFN SPI

NameValue
MfrMicrochip Technology
TypeTrusted Platform Module (TPM)
Series-
PackageTape & Reel (TR); Cut Tape (CT); Digi-Reel®
Applications-
Mounting TypeSurface Mount
Package / Case8-UFDFN Exposed Pad
Product StatusObsolete
Supplier Device Package8-UDFN (2x3)